The invention relates to the technical field of electronic packaging, in particular to a low-temperature fast-curing powdery epoxy molding compound and a preparation method thereof.The low-temperature fast-curing powdery epoxy molding compound at least comprises epoxy resin, a curing agent, inorganic filler and a catalyst, the epoxy resin at least comprises epoxy resin shown in the formula (1) and the formula (2), the mass ratio of the epoxy resin shown in the formula (1) to the epoxy resin shown in the formula (2) is (3-5): (0.5-1.5), and the curing agent is a curing agent. A compression mold can be used for injection molding, and the injection molding requirement of thin packaging and the plastic packaging process requirement of low-temperature rapid curing are met.