Patent

  • Home >
  • Technologies >
  • Adhesive Capable Of Being Rapidly Cured At Low Temperature Preparation Method Of ...

Adhesive Capable Of Being Rapidly Cured At Low Temperature Preparation Method Of Adhesive And Screen Printing Plate

PATENT

Adhesive Capable Of Being Rapidly Cured At Low Temperature Preparation Method Of Adhesive And Screen Printing Plate

The invention relates to the field of adhesives, in particular to a low-temperature fast-curing adhesive, a preparation method thereof and a screen printing plate. The low-temperature fast curing adhesive provided by the invention is prepared from the following raw materials: polyamide-imide, epoxy resin, an epoxy resin reactive diluent, a curing agent accelerator, a latent curing agent, a low-temperature curing agent, a defoaming agent and a solvent. The adhesive prepared by the preparation method disclosed by the invention has relatively low thermocuring temperature, and can be cured at the temperature of 120-130 DEG C, so that the energy consumption in the production process is effectively reduced, and the production safety is improved; and the product has high peel strength, and the peel strength is 8N/cm or above.

To view more project details and submit an expression of interest

Explore more projects

Solutions to Business Technological Challenges

REST Client (Huachao Mao)